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IBM debuts sub-1 nanometer chip technology(newsroom.ibm.com)
373 points by porridgeraisin | 198 comments
IBM newsroom press release announcing its first sub-1 nanometer chip technology built with a "nanostack" 3D chip architecture.
Microsoft unveils Majorana 1 quantum processor(azure.microsoft.com)
374 points by eksu | 139 comments
Microsoft Azure blog post announcing Majorana 1, a quantum processor built on topological qubits, written by Chetan Nayak.
Qualcomm to acquire Arduino(qualcomm.com)
1279 points by janjongboom | 519 comments
Qualcomm press release announcing its acquisition of Arduino and the new Arduino UNO Q board and App Lab powered by Qualcomm Dragonwing processors.
Related stories
FCC opens entire 6 GHz band to low power device operations(docs.fcc.gov)
702 points by impish9208 | 280 comments
FCC news release from December 11, 2024 announcing that the entire 6 GHz band is opened to very low power device operations.
NIST scientists create 'any wavelength' lasers(nist.gov)
402 points by rbanffy | 185 comments
NIST news release describing a method of stacking materials on silicon wafers to build photonic chips with lasers that can produce nearly any wavelength.
AI Laser Locking for Quantum Computers: How QuEra Automates It(quera.com)
24 points by EvgeniyZh | 5 comments
QuEra blog post describing how the company uses AI to automatically lock and tune the lasers in its neutral-atom quantum computer.
3D-printing platform rapidly produces complex electric machines(news.mit.edu)
59 points by rbanffy | 28 comments
MIT News article on a 3D-printing platform that uses multiple functional materials to fabricate an electric linear motor in hours.
Quantum information spreading via higher-order operator correlators(arxiv.org)
10 points by northlondoner | 0 comments
arXiv preprint introducing N-Operator Correlators, a generalization of out-of-time-ordered correlators for measuring quantum information spreading, with toy-model examples.
OKI Develops 124-Layer PCB Technology(oki.com)
35 points by luu | 19 comments
OKI press release announcing its development of 124-layer printed circuit board technology.












